Sejong News
Sejong University Selected for Government-Funded “Semiconductor Advanced Packaging Professional Training Program” — KRW 10.5 Billion to Be Invested Over 7 Years
이정은
2025-09-12
Sejong University (President: Woonghwa Eom) has been newly designated as a leading institution for training specialists in advanced semiconductor packaging, a key initiative to strengthen Korea’s post-processing semiconductor competitiveness.
The university was officially selected for the Semiconductor Advanced Packaging Professional Training Program, part of the Ministry of Science and ICT and the National Research Foundation of Korea’s Science and Technology Innovation Talent Development Project. The program will run for seven years starting in July 2025, with a total funding scale of KRW 10.5 billion.
This project aims to significantly enhance Korea’s competitiveness in advanced semiconductor packaging by systematically cultivating master’s and doctoral-level experts across the full spectrum of core fields—design, materials/components/equipment, processes, and reliability. The ultimate goal is to empower the domestic advanced packaging materials and equipment sector, foundries, and OSAT (Outsourced Semiconductor Assembly and Test) companies.
Led by Sejong University, the program will be operated as a consortium with Seoul National University of Science and Technology, Hanyang University, and Hongik University. Additionally, 30 mid- to small-sized enterprises in the semiconductor advanced packaging sector will participate as industry partners, providing field-based training and practical education opportunities.
Through this initiative, Sejong University will establish a Semiconductor Advanced Packaging Training Center on campus, while developing and operating joint curricula and hands-on training programs. The program targets the graduation of over 30 advanced-degree professionals by 2028 and more than 60 by 2031.
Professor Deokki Kim, program director at Sejong University, emphasized:
“This project is not just about education—it is about producing talent that can immediately meet the real demands of industry. By working closely with companies, we aim to systematically cultivate globally competitive professionals in advanced semiconductor packaging and contribute to the development of Korea’s semiconductor industry.”
Office of Public Relations (hongbo@sejong.ac.kr)